Fluctuation Free Facility (FFF),
New Industry Creation Hatchery Center (NICHe), Tohoku University
 

[ Japanese | English ]

 Contents

  ■Top
  ■About FFF
  ■Map
  ■Information
  ■Papers
  ■Reserch
  ■Link
  ■Contact Us


Research

O ur aim of research is to realize "Ultra-Large-Scale-Integration (ULSI), which features flexibility and high intelligence." The area of the research covers all silicon technologies. Currently, the focused issues are the development of infrastructure for ultra-short TAT semiconductor manufacturing, the development of manufacturing equipment using plasma, research on process technology, development of ultra-high speed device, electronic circuit for information processing with intelligence, and research on algorithms reducing computing costs.
The research issues are widely spread so that the research is proceeded by setting up many "research groups". This laboratory, which looks around the whole silicon technology, is very unique and, of course, attractive for its members.
The left-sided numbers are the links to PDF file, which are the introduction of researches.
These slides are the ones which were exhibited in an exhibition named "Semicon Japan 2017" in December 2017, at Tokyo Big Sight, Japan, which was concerned to semiconductor manufacturing.
Please care that the files are protected from PRINTING or MODIFYING for security so that you can see these files only on computer screen.


      1   Total Research Facilities〜 Semiconductor Manufacturing・Analysis・Evaluation〜
      2   Evaluation of Various Processes, Parts, Materials
      3   Cases of collaborative researches
      4    Semiconductor Manufacturing Equipments in FFF
      5     High Quality SiN and Highest Selectivity SiN/poly Dry Etching
      6     Low Resistance Source/Drain Contacts with Low Schottky Barrier for High Performance Transistors
      7     New Silicon Technologies Exhibiting Very High Speed Performance
     8   New Statistical Evaluation of MOSFET Electric Characteristics
      9     Wet Etching Technology for 3D Integrated Semiconductor Process
     10    Challenges for New Generation Cleaning Technology
     11    Microwave-Excited Ultra-Low-Electron-Temperature High-Density Plasma
     12    Radical Reaction Based Plasma Process Equipment
     13    Damage-Free Rotation Magnet Sputtering
     14    High Frequency Propagation PCBs with the Developed Dielectric Material
     15    Cr2O3 / Al2O3 Passivation Technology
     16    Highly-Reliable W-Seal Fitting
     17    Perfectly Controlled Gas Distribution System
     18    〜Vacuum Parts〜 Advanced Metal Seal High Performance Welded Bellows
     19    Fluctuation Free Facility (1)
     20    Fluctuation Free Facility (2)
     21    Outline of Cleanrooms in FFF